Engineering & Transportation | Engineering

Assembly and Reliability of Lead-Free Solder Joints

by John H. Lau

2020-09-17 05:14:22

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This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topic... Read more

This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.

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Book Details

ISBN9789811539206
autor-image
John H. Lau
Author
SPECIALIZED PROFESSIONAL COMPETENCEDesign, analysis, materials, process, manufacturing, qualification, reliability, testing, and thermal management of electronic and optoelectronic components and syst...

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